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6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules

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6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules

Brand Name : Huitian

Model Number : 6321C

Certification : SGS/NDF

Place of Origin : CHINA

MOQ : 200KG

Price : Negotiation

Payment Terms : L/C, T/T

Supply Ability : 100 TON MONTH

Delivery Time : 5-8 WORK DAYS

Packaging Details : A:200kg/drum,B:200kg/drum;A:25kg/pail,B:25kg/pail

Appearance : B Amber liquid

Packaging : 5 or 55 Gallon

Viscosity (mPa.s) (GB/T10247-2008) : 2200±300

Mixture Viscosity : 1400

Mix ratio : 1.68:1 by volume

Working time(23℃) : 90 minutes

Cure time : 80℃ condition, 2 hours

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6321C is a two component EPOXY adhesive product, specially developed for Hollow fiber membrane modules.

6321C is a two component EPOXY adhesive product, specially developed for Hollow fiber membrane modules. It has excellent properties as low viscosity, low hollow fiber climbing height, low heating point, room temperature curing, long working time and low shrinkage. Glue cured with high hardness,high compressive strength and good chemical material resistance.

Typical application
Used for the assembly of Hollow fiber membrane potting.

6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules

6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules

How to use
1.Clean up the surface of bonding materials, keep dry and clean. Oil or dusty may influence the adhesive properties.

2.Stir the component A before use, mix the glue completely 2:1 by weight, we recommend using auto-mix equipment, or the mixed glue should be handled by vacuum system before operation.
3.Dispensing the mixed glue into the potting position.
4.Wait over 8 hours, then transfer to the next process, if in winter low temperature, can be heated for faster cure.


Cautions
1. When Manual mix, please don’t mix too much glue one time, and use the mixed compound as soon as possible.
2.The component A may be a little higher viscosity in winter low temperature, we suggest you pre-heat over 2 hours under
30℃, please keep the packaging open, to avoid the gas expand, what may destroy the container.
3.Seal the unused glue for next time use, contaminated glue should no longer put into the original packaging pail.
4.Keep away from the children
5. Please refer to the product MSDS for safety information.


Packaging
Set 1: 6321C - A, 200KG/drum, 6321C - B, 200KG/drum;
Every set: 2 drums A and 1 drum B, 600KG/1 set.
Set 2: 6321C - A, 25KG/pail, 6321C - B, 25KG/pail.

6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules6321C EPOXY Electrical Potting Compound for Hollow fiber membrane modules


Product Tags:

Silicone Potting Compound

      

potting compound for electronic components

      
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